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16 y5v dielectric general specifications y5v formulations are for general-purpose use in a limited temperature range. they have a wide temperature character- istic of +22% ?2% capacitance change over the operating temperature range of ?0? to +85?. y5v? high dielectric constant allows the manufacture of the highest capacitance value in a given case size. these characteristics make y5v ideal for decoupling applica- tions within limited temperature range. capacitance range 2200 pf to 22 ? capacitance tolerances +80 ?0% operating temperature range ?0? to +85? temperature characteristic +22% to ?2% max. within operating temperature voltage ratings 10, 16, 25 and 50 vdc (+85?) dissipation factor for 50 volts: 5.0% max. for 16 and 25 volts: 7% max. for 10 volts: 10% max. insulation resistance (+25?, rvdc) 10,000 megohms min. or 1000 m - ? min., whichever is less dielectric strength 250% of rated voltage for 5 seconds at 50 mamp max. current test voltage 1.0 vrms 0.2 vrms test frequency 1 khz performance characteristics 0805 size (l" x w") 3 voltage 10v = z 16v = y 25v = 3 50v = 5 g dielectric y5v = g 104 capacitance code z capacitance tolerance z = +80 ?0% a failure rate a = not applicable t terminations t = plated ni and solder 2 packaging 2 = 7" reel 4 = 13" reel a special code a = std. product part number (see page 3 for complete part number explanation)
17 % d capacitance +20 +10 0 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 temperature c temperature coefficient -60 -50 -40 -30 -20 -10 -70 -80 d c/c (%) +20 +40 0 0 dc bias voltage capacitance change vs. dc bias voltage -60 -40 -20 -100 -80 20 40 60 80 100 y5v dielectric typical characteristic curves** insulation resistance (ohm-farads) 1,000 10,000 100 0 +20 +30 +40 +60 +50 +70 +80 +85 temperature c insulation resistance vs. temperature |z| (ohms) 10,000 1,000 10,000 frequency (hz) 0.1 m f - 0603 impedance vs. frequency 1 10 100 0.01 0.1 100,000 1,000,000 10,000,000 |z| (ohms) 1,000 10,000 frequency (hz) 0.22 m f - 0805 impedance vs. frequency 1 10 100 0.01 0.1 100,000 1,000,000 10,000,000 |z| (ohms) 1,000 10,000 frequency (hz) 1 m f - 1206 impedance vs. frequency 1 10 100 0.01 0.1 100,000 1,000,000 10,000,000 summary of capacitance ranges vs. chip size style 10v 16v 25v 50v 0402* 2.2nf - 0.1? 2.2nf - 0.1? 2.2nf - 22nf 2.2nf - 10nf 0603* 2.2nf - 1? 2.2nf - 0.33? 2.2nf - 0.22? 2.2nf - 56nf 0805* 10nf - 4.7? 10nf - 2.2? 10nf - 1? 10nf - 0.33? 1206* 10nf - 10? 10nf - 4.7? 10nf - 2.2? 10nf - 1? 1210* 10nf - 22? 0.1? - 10? 0.1? - 4.7? 0.1? - 1? 1812* ?? 0.15? - 1.5? 1.5nf - 1.5? 1825* ?? 0.47? - 1.5? 0.47? - 1.5? 2220 1? - 1.5? 2225 ?? 0.68? - 2.2? 0.68? - 1.5? * standard sizes ** for additional information on performance changes with operating conditions consult avx? software spicap.
18 y5v dielectric capacitance range *reflow soldering only. notes: for low profile product, see page 19. preferred sizes are shaded 16 25 50 25 50 25 50 50 25 50 size 0402* 0603* 0805 1206 1210 1812* 1825* 2220* 2225* standard reel all paper all paper paper/embossed paper/embossed paper/embossed all embossed all embossed all embossed all embossed packaging (l) length mm 1.00 .10 1.60 .15 2.01 .20 3.20 .20 3.20 .20 4.50 .30 4.50 .30 5.7 0.4 5.72 .25 (in.) (.040 .004) (.063 .006) (.079 .008) (.126 .008) (.126 .008) (.177 .012) (.252 .016) (.225 .016) (.225 .010) (w) width mm .50 .10 .81 .15 1.25 .20 1.60 .20 2.50 .20 3.20 .20 6.40 .40 5.0 0.4 6.35 .25 (in.) (.020 .004) (.032 .006) (.049 .008) (.063 .008) (.098 .008) (.126 .008) (.252 .016) (.197 .016) (.250 .010) (t) max. thickness mm .60 .90 1.30 1.50 1.70 1.70 1.70 2.30 1.70 (in.) (.024) (.035) (.051) (.059) (.067) (.067) (.067) (.090) (.067) (t) terminal mm .25 .15 .35 .15 .50 .25 .50 .25 .50 .25 .61 .36 .61 .36 .64 .39 .64 .39 (in.) (.010 .006) (.014 .006) (.020 .010) (.020 .010) (.020 .010) (.024 .014) (.024 .014) (.025 .015) (.025 .015) wvdc 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 cap 2200 (pf) 2700 3300 3900 4700 5600 6800 8200 cap .01 (?) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 .10 .12 .15 .18 .22 .27 .33 .39 .47 .56 .68 .82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 = paper tape = embossed tape l . . . . w . . . . t t
3 how to order part number explanation example: 08055a101jat2a 0805 size (l" x w") 0402 0504 0603 0805 1005 0907 1206 1210 1505 1805 1808 1812 1825 2225 3640 5 voltage 10v = z 16v = y 25v = 3 50v = 5 100v = 1 200v = 2 250v = v 500v = 7 600v = c 1000v = a 1500v = s 2000v = g 2500v = w 3000v = h 4000v = j 5000v = k a dielectric c0g (np0) = a x7r = c x5r = d z5u = e y5v = g 101 capacitance code (2 significant digits + no. of zeros) examples: j capacitance tolerance a failure rate a = not applicable t terminations 2a special** code 10 pf = 100 100 pf = 101 1,000 pf = 102 22,000 pf = 223 220,000 pf = 224 1 ? = 105 c = ?25 pf* d = ?50 pf* f = ?% ( 3 25 pf) g = ?% ( 3 13 pf) j = ?% k = ?0% m = ?0% z = +80%, -20% p = +100%, -0% others: 7 = bulk cassette 9 = bulk * c&d tolerances for # 10 pf values. ** standard tape and reel material depends upon chip size and thickness. see individual part tables for tape material type for each capacitance value. note: unmarked product is standard. marked product is available on special request, please contact avx. standard packaging is shown in the individual tables. non-standard packaging is available on special request, please contact avx. standard: t = ni and tin plated a = standard product non-standard p = embossed unmarked m = embossed marked e = standard packaging marked low profile chips only max. thickness t = .66mm (.026") s = .56mm (.022") r = .46mm (.018") for values below 10 pf, use ??in place of decimal point, e.g., 9.1 pfd = 9r1. recommended: 2 =7" reel 4 =13" reel others: 7 = plated ni gold plated 1 = pd/ag packaging**
41 surface mounting guide mlc chip capacitors component pad design component pads should be designed to achieve good sol- der filets and minimize component movement during reflow soldering. pad designs are given below for the most com- mon sizes of multilayer ceramic capacitors for both wave and reflow soldering. the basis of these designs is: ?pad width equal to component width. it is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. ?pad overlap 0.5mm beneath component. ?pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering. d1 d2 d3 d4 d5 case size d1 d2 d3 d4 d5 0402 1.70 (0.07) 0.60 (0.02) 0.50 (0.02) 0.60 (0.02) 0.50 (0.02) 0603 2.30 (0.09) 0.80 (0.03) 0.70 (0.03) 0.80 (0.03) 0.75 (0.03) 0805 3.00 (0.12) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.25 (0.05) 1206 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 1.60 (0.06) 1210 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 2.50 (0.10) 1808 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 2.00 (0.08) 1812 5.60 (0.22) 1.00 (0.04)) 3.60 (0.14) 1.00 (0.04) 3.00 (0.12) 1825 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 6.35 (0.25) 2220 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 5.00 (0.20) 2225 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 6.35 (0.25) dimensions in millimeters (inches) reflow soldering
42 wave soldering component spacing for wave soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of solder to penetrate properly into small spaces). this is less impor- tant for reflow soldering but sufficient space must be allowed to enable rework should it be required. preheat & soldering the rate of preheat should not exceed 4?/second to prevent thermal shock. a better maximum figure is about 2?/second. for capacitors size 1206 and below, with a maximum thickness of 1.25mm, it is generally permissible to allow a temperature differential from preheat to soldering of 150?. in all other cases this differential should not exceed 100?. for further specific application or process advice, please consult avx. cleaning care should be taken to ensure that the capacitors are thoroughly cleaned of flux residues especially the space beneath the capacitor. such residues may otherwise become conductive and effectively offer a low resistance bypass to the capacitor. ultrasonic cleaning is permissible, the recommended conditions being 8 watts/litre at 20-45 khz, with a process cycle of 2 minutes vapor rinse, 2 minutes immersion in the ultrasonic solvent bath and finally 2 minutes vapor rinse. surface mounting guide mlc chip capacitors d1 d2 d3 d4 d5 case size d1 d2 d3 d4 d5 0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03) 0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05) 1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06) 1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10) dimensions in millimeters (inches) 3 1mm (0.04) 3 1.5mm (0.06) 3 1mm (0.04)
43 surface mounting guide mlc chip capacitors application notes storage good solderability is maintained for at least twelve months, provided the components are stored in their ?s received packaging at less than 40? and 70% rh. solderability terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ?? for 2? seconds. leaching terminations will resist leaching for at least the immersion times and conditions shown below. recommended soldering profiles general surface mounting chip multilayer ceramic capacitors are designed for soldering to printed circuit boards or other substrates. the construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods. handling chip multilayer ceramic capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of tweezers or vacuum pick ups is strongly recommended for individual components. bulk handling should ensure that abrasion and mechanical shock are minimized. taped and reeled components provides the ideal medium for direct presentation to the placement machine. any mechanical shock should be minimized during handling chip multilayer ceramic capacitors. preheat it is important to avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore required. the rate of preheat should not exceed 4?/second and a target figure 2?/second is recommended. although an 80? to 120? temperature differential is preferred, recent developments allow a temperature differential between the component surface and the soldering temper- ature of 150? (maximum) for capacitors of 1210 size and below with a maximum thickness of 1.25mm. the user is cautioned that the risk of thermal shock increases as chip size or temperature differential increases. soldering mildly activated rosin fluxes are preferred. the minimum amount of solder to give a good joint should be used. excessive solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. avx terminations are suitable for all wave and reflow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. cooling natural cooling in air is preferred, as this minimizes stresses within the soldered joint. when forced air cooling is used, cooling rate should not exceed 4?/second. quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above. cleaning flux residues may be hygroscopic or acidic and must be removed. avx mlc capacitors are acceptable for use with all of the solvents described in the specifications mil-std- 202 and eia-rs-198. alcohol based solvents are acceptable and properly controlled water cleaning systems are also acceptable. many other solvents have been proven successful, and most solvents that are acceptable to other components on circuit assemblies are equally acceptable for use with ceramic capacitors. termination type solder solder immersion time tin/lead/silver temp. ? seconds nickel barrier 60/40/0 260? 30? reflow 300 250 200 150 100 50 0 solder temp. 10 sec. max 1min 1min (minimize soldering time) natural cooling 220 c to 250 c preheat wave 300 250 200 150 100 50 0 solder temp. (preheat chips before soldering) t/maximum 150 c 3 sec. max 1 to 2 min preheat natural cooling 230 c to 250 c t
32 packaging of chip components automatic insertion packaging tape & reel quantities all tape and reel specifications are in compliance with rs481. 8mm 12mm paper or embossed carrier 0805, 1005, 1206, 1210 embossed only 0504, 0907 1505, 1805, 1812, 1825 1808 2220, 2225 paper only 0402, 0603 qty. per reel/7" reel 2,000 or 4,000 (1) 3,000 1,000 qty. per reel/13" reel 10,000 10,000 4,000 (1) dependent on chip thickness. low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are not available on 13" reels. for 3640 size chip contact factory for quantity per reel. reel dimensions tape a b* c d* n w 1 w 2 w 3 size (1) max. min. min. min. max. +1.0 7.9 min. 8mm 8.4 ?.0 14.4 (.311) (.331 +.060 ) (.567) 10.9 max. 330 1.5 13.0?.20 20.2 50 ?.0 (.429) (12.992) (.059) (.512?008) (.795) (1.969) +2.0 11.9 min. 12mm 12.4 ?.0 18.4 (.469) (.488 +.076 ) (.724) 15.4 max. ?.0 (.607) metric dimensions will govern. english measurements rounded and for reference only. (1) for tape sizes 16mm and 24mm (used with chip size 3640) consult eia rs-481 latest revision.
33 tape size b 1 d 1 fp 1 rt 2 wa 0 b 0 k 0 max. min. min. see note 6 see note 5 see note 2 8mm 4.55 1.0 3.5 0.05 4.0 0.10 25 2.5 max see note 1 (.179) (.039) (.138 .002) (.157 .004) (.984) (.098) 12mm 8.2 1.5 5.5 0.05 4.0 0.10 30 6.5 max. 12.0 .30 see note 1 (.323) (.059) (.217 .002) (.157 .004) (1.181) (.256) (.472 .012) 8mm 4.55 1.0 3.5 0.05 2.0 0.10 25 2.5 max. see note 1 1/2 pitch (.179) (.039) (.138 .002) 0.79 .004 (.984) (.098) 12mm 8.2 1.5 5.5 0.05 8.0 0.10 30 6.5 max. 12.0 .30 see note 1 double (.323) (.059) (.217 .002) (.315 .004) (1.181) (.256) (.472 .012) pitch embossed carrier configuration 8 & 12mm tape only 8 & 12mm embossed tape metric dimensions will govern constant dimensions tape size d 0 ep 0 p 2 t max. t 1 g 1 g 2 8mm 8.4 +0.10 1.75 0.10 4.0 0.10 2.0 0.05 0.600 0.10 0.75 0.75 -0.0 and (.059 +.004 ) (.069 .004) (.157 .004) (.079 .002) (.024) (.004) (.030) (.030) 12mm -0.0 max. min. min. see note 3 see note 4 variable dimensions notes: 1. a 0 , b 0 , and k 0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. the clearance between the end of the terminals or body of the component to the sides and depth of the cavity (a 0 , b 0 , and k 0 ) must be within 0.05 mm (.002) min. and 0.50 mm (.020) max. the clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (se e sketches c & d). 2. tape with components shall pass around radius ??without damage. the minimum trailer length (note 2 fig. 3) may require add itional length to provide r min. for 12 mm embossed tape for reels with hub diameters approaching n min. (table 4). 3. g 1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. g 2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of t he carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 6. b 1 dimension is a reference dimension for tape feeder clearance only. 8.0 +0.3 -0.1 (.315 +.012 ) -.004 8.0 +0.3 -0.1 (.315 +.012 ) -.004
tape size p 1 fwa 0 b 0 t 8mm 4.0 0.10 3.5 0.05 see note 1 see note 3 (.157 .004) (.138 .002) 12mm 4.0 .010 5.5 0.05 12.0 0.3 (.157 .004) (.217 .002) (.472 .012) 8mm 2.0 0.10 3.5 0.05 1/2 pitch (.079 .004) (.138 .002) 12mm 8.0 0.10 5.5 0.05 12.0 0.3 double (.315 .004) (.217 .002) (.472 .012) pitch 34 paper carrier configuration 8 & 12mm tape only 8 & 12mm paper tape metric dimensions will govern constant dimensions tape size d 0 ep 0 p 2 t 1 g 1 g 2 r min. 8mm 1.5 +0.1 1.75 0.10 4.0 0.10 2.0 0.05 0.10 0.75 0.75 25 (.984) -0.0 and (.059 +.004 ) (.069 .004) (.157 .004) (.079 .002) (.004) (.030) (.030) see note 2 12mm -.000 max. min. min. variable dimensions notes: 1. a 0 , b 0 , and t are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body di mensions of the component. the clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (a 0 , b 0 , and t) must be within 0.05 mm (.002) min. and 0.50 mm (.020) max. the clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (se e sketches a & b). 2. tape with components shall pass around radius ??without damage. 3. 1.1 mm (.043) base tape and 1.6 mm (.063) max. for non-paper base compositions. 8.0 +0.3 -0.1 (.315 +.012 ) -.004 8.0 +0.3 -0.1 (.315 +.012 ) -.004 bar code labeling standard avx bar code labeling is available and follows latest version of eia-556-a.
35 bulk case packaging case quantities part size 0402 0603 0805 qty. 10,000 (t=0.6mm) (pcs / cassette) 80,000 15,000 5,000 (t? 3 0.6mm) benefits bulk feeder ?easier handling ?smaller packaging volume (1/20 of t/r packaging) ?easier inventory control ?flexibility ?recyclable case dimensions shutter slider attachment base 110mm 12mm 36mm case cassette gate shooter chips expanded drawing mounter head

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